Computational modeling of thermal management in electronic packaging design and operation

Publication Year:
1998
Usage 628
Downloads 626
Abstract Views 2
Repository URL:
https://digitalcommons.ohsu.edu/etd/2603
DOI:
10.6083/m4pc30m1
Author(s):
Wei, Wen
Publisher(s):
Oregon Health & Science University
thesis / dissertation description
By Wen Wei, Published on 06/01/98