Creep of parylene-C film

Citation data:

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, Page: 2698-2701

Publication Year:
2011
Usage 3
Abstract Views 2
Clicks 1
Captures 5
Readers 5
Citations 6
Citation Indexes 6
Repository URL:
http://hdl.handle.net/10754/597893
DOI:
10.1109/transducers.2011.5969483
Author(s):
Lin, Jeffrey Chun-Hui; Deng, Peigang; Lam, Gilbert; Lu, Bo; Lee, Yi-Kuen; Tai, Yu-Chong
Publisher(s):
Institute of Electrical and Electronics Engineers (IEEE)
Tags:
Computer Science; Engineering; Creep; glass transition temperature; parylene-C; viscoelasticity
conference paper description
The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger's model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there's little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes. © 2011 IEEE.