Application of an exact integral transform formulation for temperature estimation in solid-state electronics
Journal of the Brazilian Society of Mechanical Sciences and Engineering, ISSN: 1806-3691, Vol: 43, Issue: 4
2021
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Article Description
This work presents an application of an exact analytical approach to estimate the temperature field of solid-state electronics (SSE). A partial lumped approach in the chip’s height was performed, obtaining a two-dimensional mathematical model. The internal heat generation (HG) regions caused by Joule effect due to internal components were modeled as Gaussian functions, and the classical integral transform technique (CITT) was used to solve the problem. The developed formulation was applied in three illustrative HG layouts for chips. In addition, the finite difference method was also implemented for verification and comparison purposes. The CITT provided fast computing and accurate results with small truncation orders in problems with multiple non-uniform heated regions. Furthermore, the formulation presented in this work may be applied to any SSE internal HGs layout, being a useful tool for thermal assessment of SSEs.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85102693586&origin=inward; http://dx.doi.org/10.1007/s40430-021-02912-x; https://link.springer.com/10.1007/s40430-021-02912-x; https://link.springer.com/content/pdf/10.1007/s40430-021-02912-x.pdf; https://link.springer.com/article/10.1007/s40430-021-02912-x/fulltext.html; https://dx.doi.org/10.1007/s40430-021-02912-x; https://link.springer.com/article/10.1007/s40430-021-02912-x
Springer Science and Business Media LLC
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