Microstructural studies on fire-through front contact metallization of Si solar cells
2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts, Page: 364-367
2011
- 2Citations
- 8Captures
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Conference Paper Description
Screen-printed Silver/Argentum (Ag) metallization is used in the photovoltaic industry for the front-side emitter contacts of crystalline silicon solar cells owing to its cost-effectiveness and high throughput. In order to obtain a better understanding for the formation of Ag paste and silicon (Si) interface, the firing treatment was studied. The microstructure properties of the fire-through Ag metal contacts formed on pyramid textured silicon wafers are investigated. The best firing temperature is 800 C with an open circuit voltage at 0.504V and efficiency of 13.67%. The Scanning Electron Microscopy (SEM) characterization of Ag shows that as the temperature further increased, the particles of Ag fuse together and the decrease of the Ag thin film thickness indicates that n layer has been formed. © 2011 IEEE.
Bibliographic Details
Institute of Electrical and Electronics Engineers (IEEE)
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