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Flexible Polyurethane Adhesives: Predictive Numerical Model Calibration through Experimental Testing at Elevated Temperature

Applied Sciences (Switzerland), ISSN: 2076-3417, Vol: 14, Issue: 5
2024
  • 2
    Citations
  • 0
    Usage
  • 20
    Captures
  • 1
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    2
  • Captures
    20
  • Mentions
    1
    • News Mentions
      1
      • News
        1

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Polytechnic University of Bari Researcher Describes Recent Advances in Applied Sciences (Flexible Polyurethane Adhesives: Predictive Numerical Model Calibration through Experimental Testing at Elevated Temperature)

2024 MAR 15 (NewsRx) -- By a News Reporter-Staff News Editor at NewsRx Science Daily -- Investigators publish new report on applied sciences. According to

Article Description

The thermo-mechanical behavior of polyurethane adhesive joints in wood structures is a crucial aspect that needs to be understood to ensure the durability and safety of timber structures, especially in seismic regions. As mass timber, particularly cross-laminated timber, continues to gain popularity as a building material, it is important to pay special attention to the behavior of connections between the timber elements. The use of flexible polyurethane adhesives presents a promising alternative to conventional mechanical connections in seismic-resistant timber structures. This research highlights the potential of polyurethane-based joints at elevated service temperature, offers a promising alternative to traditional wood joints, and suggests viability for post-fire restoration of wood structures. The response at the interface between wood and polyurethane under flexural stresses is also evaluated, underscoring the broader application possibilities of flexible adhesives in wood construction for mechanical and physical improvements.

Bibliographic Details

Armando La Scala; Fabio Rizzo; Maria Francesca Sabbà; Klaudia Śliwa-Wieczorek; Bogusław Zając

MDPI AG

Materials Science; Physics and Astronomy; Engineering; Chemical Engineering; Computer Science

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