A study of effect of bond length on bond strength using transient heat transfer analysis

It is important to understand the mechanical properties of the bonding between the adjacent layers of 3D printed parts build by fused deposition modeling. The bonding process is highly nonlinear and depends on various geometrical and thermal process parameters. This work aims to quantify the degree of bonding by calculating bond potential between the extruded layers using finite element heat transfer analysis. Successive transient analysis were carried out using this model by constantly updating the boundary conditions and geometric model during the deposition of the extruded bead. Temperatures at critical points were calculated over a period to calculate the bond potential and analyze the degree of bonding between layers printed in the z-axis. Furthermore, geometry and heat transfer coefficient were altered to investigate their influence on the bond potential. Finally, the experimental analysis was carried out by printing tensile specimens according to the FE model to investigate any relationship between the calculated bond potential and strength of the FDM parts.