Studies of TEM mode assumption on via holes in via modelings
cccc2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings, Page: 605-608
2012
- 6Citations
- 9Usage
- 1Captures
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Metrics Details
- Citations6
- Citation Indexes6
- CrossRef6
- Usage9
- Downloads9
- Captures1
- Readers1
Conference Paper Description
The assumption of transverse electromagnetic (TEM) field distribution on via holes is checked by a two-dimensional (2D) finite difference method (FDM). It is found that for a via without pad, TEM mode assumption is a quite good approximation. However, for a via with a pad, i.e. the via pad radius is different from the via barrel radius, the field distribution on the via hole begins to deviate from the TEM mode. This indicates previous analytical formula for a via with pad may need to be modified at very high frequencies due to its usage of TEM field assumption on via holes. The results obtained by 2D FDM have been verified by a three-dimensional commercial electrostatic solver. © 2012 IEEE.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84864861789&origin=inward; http://dx.doi.org/10.1109/apemc.2012.6237873; http://ieeexplore.ieee.org/document/6237873/; http://xplorestaging.ieee.org/ielx5/6230781/6237787/06237873.pdf?arnumber=6237873; https://scholarsmine.mst.edu/ele_comeng_facwork/6284; https://scholarsmine.mst.edu/cgi/viewcontent.cgi?article=7313&context=ele_comeng_facwork
Institute of Electrical and Electronics Engineers (IEEE)
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