Thermal Characterization of a System on Chip (SoC)

Publication Year:
2013
Usage 781
Downloads 677
Abstract Views 104
Repository URL:
https://digitalcommons.calpoly.edu/imesp/107
Author(s):
Gilstrap, James
Tags:
Thermal characteristics; chip; SoC; Industrial Engineering; Manufacturing; Operations Research, Systems Engineering and Industrial Engineering
article description
Electronics are getting more and more advanced. Companies are designing their product to be more powerful, but at the same time they are designing them to be smaller and more user friendly. Heat becomes a major factor with the limited amount of surface area. The objective of this project is to measure the junction temperature of three system on chips (SoC) under various loading conditions and their time constant. The junction temperature was measured based on the diode’s I-V linear relationship. Both calibration and measurement of the junction temperature were conducted for three different SoC packages. The measurement results can be compared with the simulation results from a thermal design program such as Icepak or Solidworks. The results can also be used to optimize the board design.