Effect of substrate temperature on the interface bond between support and substrate during selective laser melting of Al–Ni–Y–Co–La metallic glass

Citation data:

Materials and Design, ISSN: 0264-1275, Vol: 65, Page: 1-6

Publication Year:
2014
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Citations 29
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Repository URL:
https://research-repository.uwa.edu.au/en/publications/69f2b3c0-5925-4db0-b1be-0cb039ef8346; https://ro.ecu.edu.au/ecuworkspost2013/959
DOI:
10.1016/j.matdes.2014.08.065
Author(s):
Li, X. P.; Roberts, M.; Liu, Y. J.; Kang, C. W.; Huang, H.; Sercombe, T. B.
Publisher(s):
Elsevier BV; Elsevier
Tags:
Materials Science; Engineering; [RstdPub]. Selective laser melting; Metallic glass; Interface; Solidification microstructure; Nanoindentation; Engineering Science and Materials
article description
An Al–Ni–Y–Co–La metallic glass was laser-melted onto an Al substrate which was at two different temperatures: 25 °C and 250 °C. It was found that the substrate temperature played a critical role in determining the interface bonding between substrate and support and final solidification microstructures. The higher substrate temperature resulted in the formation of a stronger interface bond between metallic glass and substrate while lower substrate temperature resulted in the formation of a weaker interface bond. This has been attributed to different cooling rates and thermal histories present in the two cases. A multi-physics-based computational model based on the heat transfer theory in heat transient mode of COMSOL™ was introduced to explain the underlying mechanism.