Onboard Device Encapsulation With Two-Phase Cooling

Citation data:

Journal of Thermal Science and Engineering Applications, ISSN: 1948-5085, Vol: 10, Issue: 2

Publication Year:
2018
Usage 4
Abstract Views 4
DOI:
10.1115/1.4037130
Author(s):
S. J. Young, D. Janssen, E. A. Wenzel, B. M. Shadakofsky, F. A. Kulacki
Publisher(s):
ASME International
Tags:
Materials Science, Physics and Astronomy, Engineering, Chemical Engineering
article description
Onboard liquid cooling of electronic devices is demonstrated with liquid delivered externally to the point of heat removal through a conformal encapsulation. The encapsulation creates a flat microgap above the integrated circuit (IC) and delivers a uniform inlet coolant flow over the device. The coolant is Novec7200, and the electronics are simulated with a resistance heater on a 1:1 scale. Thermal performance is demonstrated at power densities of ~1 kW/cmin the microgap. Parameters investigated are pressure drop, average device temperature, heat transfer coefficient, and coefficient of performance (COP). Nusselt numbers for gap sizes of 0.25, 0.5, and 0.75mm are reduced to a dimensionless correlation. With low coolant inlet subcooling, two-phase heat transfer is seen at all mass flows. Device temperatures reach 95 ° C for power dissipation of 50-80W (0.67-1.08 kW/cm) depending on coolant flow for a gap of 0.5 mm. Coefficients of performance of ~100 to 70,000 are determined via measured pressure drop and demonstrate a low pumping penalty at the device level within the range of power and coolant flow considered. The encapsulation with microgap flow boiling provides a means for use of higher power central processing unit and graphics processing unit devices and thereby enables higher computing performance, for example, in embedded airborne computers.

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