Layer Encapsulation of Quantum Dots on Chip on Board Type White LEDs

Citation data:

Molecular Crystals and Liquid Crystals, ISSN: 1542-1406, Vol: 564, Issue: 1, Page: 18-25

Publication Year:
2012
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Repository URL:
http://scholarworks.unist.ac.kr/handle/201301/16944
DOI:
10.1080/15421406.2012.690642
Author(s):
Kwak, Seong Kwon, Yoo, Tae Wook, Kim, Bo-Sung, Lee, Sang Mun, Kim, Seok Won, Lee, Dong Wook, Hur, Youngjune, Park, Lee Soon
Publisher(s):
Informa UK Limited, TAYLOR & FRANCIS LTD
Tags:
Chemistry, Materials Science, Physics and Astronomy, Light emitting diode, LED, encapsulation, chip on board, MCPCB, LIGHT EMISSION, RESISTANCE, DIODES
article description
The chip on board (COB) types LED modules were fabricated by using metal core printed circuit board (mcPCB), aluminium oxide (Al O ) and aluminium nitride (AlN) as submounts of LED chips. The radiant flux of the LEDs exhibited slight difference in terms of the LED chip bonding process in which eutectic bonding gave higher radiant flux than Ag epoxy bonding in both AlN and Al O substrates. However the LED modules fabricated on AlN ceramic substrate exhibited higher radiant flux than the one on Al O substrate at high current due to more effective heat dissipation in case of AlN substrate. The WLED modules encapsulated with YAG phosphor and red QD by layer-by-layer mode showed both high total luminous flux and high color rendering index. © 2012 Taylor & Francis Group, LLC.

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