Transparent Conducting Film Fabricated by Metal Mesh Method with Ag and Cu@Ag Mixture Nanoparticle Pastes

Citation data:

Metals, ISSN: 2075-4701, Vol: 7, Issue: 5, Page: 176

Publication Year:
2017

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Repository URL:
http://scholarworks.unist.ac.kr/handle/201301/22319
DOI:
10.3390/met7050176
Author(s):
Nam, Hyun Min, Seo, Duck Min, Yun, Hyung Duk, Thangavel, Gurunathan, Park, Lee Soon, Nam, Su Yong
Publisher(s):
MDPI AG
Tags:
Materials Science, synthesis of core&#8211, shell metal nanoparticles, Cu@Ag composite nanoparticle, metal mesh, screen printing, touch screen panel
article description
Transparent conducting electrode film is highly desirable for application in touch screen panels (TSPs), flexible and wearable displays, sensors, and actuators. A sputtered film of indium tin oxide (ITO) shows high transmittance (90%) at low sheet resistance (50 Ω/cm). However, ITO films lack mechanical flexibility, especially under bending stress, and have limitation in application to large-area TSPs (over 15 inches) due to the trade-off in high transmittance and low sheet resistance properties. One promising solution is to use metal mesh-type transparent conducting film, especially for touch panel application. In this work, we investigated such inter-related issues as UV imprinting process to make a trench layer pattern, the synthesis of core-shell-type Ag and Cu@Ag composite nanoparticles and their paste formulation, the filling of Ag and Cu@Ag mixture nanoparticle paste to the trench layer, and touch panel fabrication processes.

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