Interconnect
Advanced Driver Assistance Systems and Autonomous Vehicles: From Fundamentals to Applications, Page: 181-212
2022
- 2Citations
- 81Captures
Metric Options: CountsSelecting the 1-year or 3-year option will change the metrics count to percentiles, illustrating how an article or review compares to other articles or reviews within the selected time period in the same journal. Selecting the 1-year option compares the metrics against other articles/reviews that were also published in the same calendar year. Selecting the 3-year option compares the metrics against other articles/reviews that were also published in the same calendar year plus the two years prior.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Book Chapter Description
Interconnect could provide physical and logical connection between two electronic devices with interconnect with affordable quality and reliability, and thus interconnect is critical for the development of Advanced Driver Assistance Systems (ADAS). In this chapter, interconnects and solder joint technology for applications under the hood are reviewed. In addition, the bonding techniques by using Cu-Cu direct bonding and hybrid bonding are presented.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85151498401&origin=inward; http://dx.doi.org/10.1007/978-981-19-5053-7_6; https://link.springer.com/10.1007/978-981-19-5053-7_6; https://dx.doi.org/10.1007/978-981-19-5053-7_6; https://link.springer.com/chapter/10.1007/978-981-19-5053-7_6
Springer Science and Business Media LLC
Provide Feedback
Have ideas for a new metric? Would you like to see something else here?Let us know