Relationship between giant magnetoresistance of NiFe/Cu multilayers and their microstructures
Chinese Science Bulletin, ISSN: 1001-6538, Vol: 43, Issue: 15, Page: 1268-1271
1998
- 2Citations
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Metrics Details
- Citations2
- Citation Indexes2
- CrossRef1
Article Description
The (111)-orientated NiFe/Cu multilayers were prepared by magnetron sputtering method. At room temperature, saturation magnetoresistances of NiFe/CU multilayers oscillate as a function of Cu spacer layer thickness. Two peak GMR values of 19.4%, 11.6% and 11.2%, 1% appear, respectively, at Cu sublayer thickness of t= 1.0, 2.2 nm while the deposition pressures are 0.25 and 0.45 Pa. X-ray small-angle reflections and diffuse scattering at Cu K-edge (8.979 keV) by synchrotron radiation source were used to characterize the interfacial roughness. Diffraction anomalous fine-structure scattering (DAFS) was performed to investigate the local structure of NiFe and Cu sublayers. Results show that the deposition pressure has effect on interfacial roughness of the samples obviously, and the interfacial roughness also affects the GMR values of the samples strongly.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=0542394516&origin=inward; http://dx.doi.org/10.1007/bf02884139; http://link.springer.com/10.1007/BF02884139; http://link.springer.com/content/pdf/10.1007/BF02884139; http://link.springer.com/content/pdf/10.1007/BF02884139.pdf; http://link.springer.com/article/10.1007/BF02884139/fulltext.html; http://www.springerlink.com/index/10.1007/BF02884139; http://www.springerlink.com/index/pdf/10.1007/BF02884139; https://dx.doi.org/10.1007/bf02884139; https://link.springer.com/article/10.1007/BF02884139
Springer Science and Business Media LLC
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