Stress induced grain boundaries in thin Co layer deposited on Au and Cu
Applied Physics A: Materials Science and Processing, ISSN: 1432-0630, Vol: 122, Issue: 10
2016
- 5Citations
- 5Captures
Metric Options: Counts1 Year3 YearSelecting the 1-year or 3-year option will change the metrics count to percentiles, illustrating how an article or review compares to other articles or reviews within the selected time period in the same journal. Selecting the 1-year option compares the metrics against other articles/reviews that were also published in the same calendar year. Selecting the 3-year option compares the metrics against other articles/reviews that were also published in the same calendar year plus the two years prior.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
In this work, the structure and stress evolution in Co/Au and Co/Cu two-layer systems during deposition were studied. The growth of this system is evaluated by employing molecular dynamic simulations with potentials based on the embedded atom method theory. We used the kinematical scattering theory and the Ackland–Jones bond-angle method to the structural characterisation of deposited layers. In both systems, only compressive stress is observed during the deposition process and process relaxation of stress is visible. In Co/Au systems, creation of grains and grain boundaries is observed.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84988421039&origin=inward; http://dx.doi.org/10.1007/s00339-016-0432-x; http://link.springer.com/10.1007/s00339-016-0432-x; http://link.springer.com/content/pdf/10.1007/s00339-016-0432-x.pdf; http://link.springer.com/article/10.1007/s00339-016-0432-x/fulltext.html; https://dx.doi.org/10.1007/s00339-016-0432-x; https://link.springer.com/article/10.1007/s00339-016-0432-x
Springer Nature
Provide Feedback
Have ideas for a new metric? Would you like to see something else here?Let us know