Molecular dynamics simulation of peeling a DNA molecule on substrate
Acta Mechanica Sinica/Lixue Xuebao, ISSN: 0567-7718, Vol: 21, Issue: 3, Page: 249-256
2005
- 35Citations
- 40Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Metrics Details
- Citations35
- Citation Indexes35
- 35
- CrossRef29
- Captures40
- Readers40
- 40
Article Description
Molecular dynamics (MD) simulations are performed to study adhesion and peeling of a short fragment of single strand DNA (ssDNA) molecule from a graphite surface. The critical peel-off force is found to depend on both the peeling angle and the elasticity of ssDNA. For the short ssDNA strand under investigation, we show that the simulation results can be explained by a continuum model of an adhesive elastic band on substrate. The analysis suggests that it is often the peak value, rather than the mean value, of adhesion energy which determines the peeling of a nanoscale material.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=23444434530&origin=inward; http://dx.doi.org/10.1007/s10409-005-0027-9; http://link.springer.com/10.1007/s10409-005-0027-9; http://link.springer.com/content/pdf/10.1007/s10409-005-0027-9; http://link.springer.com/content/pdf/10.1007/s10409-005-0027-9.pdf; http://link.springer.com/article/10.1007/s10409-005-0027-9/fulltext.html; https://dx.doi.org/10.1007/s10409-005-0027-9; https://link.springer.com/article/10.1007/s10409-005-0027-9; http://sciencechina.cn/gw.jsp?action=cited_outline.jsp&type=1&id=2235038&internal_id=2235038&from=elsevier; http://www.springerlink.com/index/10.1007/s10409-005-0027-9; http://www.springerlink.com/index/pdf/10.1007/s10409-005-0027-9
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