Elastocaloric effect with small hysteresis in bamboo-grained Cu–Al–Mn microwires
Journal of Materials Science, ISSN: 1573-4803, Vol: 54, Issue: 13, Page: 9613-9621
2019
- 34Citations
- 39Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
The elastocaloric effect in Cu–Al–Mn shape memory alloy microwires fabricated by Taylor–Ulitovsky method was investigated. The microwires with bamboo-like grain architecture, homogeneous composition and favorable orientation were successfully prepared through high-temperature annealing heat treatment. The formation of the bamboo grains and high specific surface area contribute to the reduced martensite transformation hysteresis. A large recoverable strain up to 8.8% was achieved by two-way shape memory cycling under a low stress of 50 MPa. Consequently, the microwire exhibited a large entropy change ΔS = 16.1 J kg K . Furthermore, the refrigeration capacity (RC) reached ~ 502 J kg over a working temperature interval ΔT = 31 K during direct transformation under 50 MPa uniaxial stress. Finally, a reversible adiabatic temperature change ΔT = 3.9 K under a stress of 150 MPa was obtained. This proves that the present Cu–Al–Mn microwire, with bamboo grains, high refrigeration property and low cost, may act as promising candidate materials for elastocaloric cooling.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85064220974&origin=inward; http://dx.doi.org/10.1007/s10853-019-03592-8; http://link.springer.com/10.1007/s10853-019-03592-8; http://link.springer.com/content/pdf/10.1007/s10853-019-03592-8.pdf; http://link.springer.com/article/10.1007/s10853-019-03592-8/fulltext.html; https://dx.doi.org/10.1007/s10853-019-03592-8; https://link.springer.com/article/10.1007/s10853-019-03592-8
Springer Science and Business Media LLC
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