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Virtual texture analysis to investigate the deformation mechanisms in metal microstructures at the atomic scale

Journal of Materials Science, ISSN: 1573-4803, Vol: 57, Issue: 23, Page: 10549-10568
2022
  • 14
    Citations
  • 0
    Usage
  • 14
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    14
    • Citation Indexes
      14
  • Captures
    14

Article Description

Understanding the deformation behavior of metallic materials at high strain rates requires the characterization of plasticity contributors, such as twins, phase transformed regions, and dislocations. However, predicting the contributions from phase transformation and twinning relies on a complete understanding of the selection of variants for various loading orientations and the evolution of their volume fractions. This manuscript presents a new virtual texture (VirTex) analysis approach to characterize phase transformation and twinning variants in deformed microstructures generated using molecular dynamics (MD) simulations. The VirTex method involves the construction of a rotation matrix to calculate the angle/axis pairs and misorientation angles for each atom in the microstructure. Any changes in the orientation angle from angle/axis pairs and/or structure types are analyzed to determine the nucleation and evolution of variants in the microstructure. The study uses shock deformed single-crystal Fe, Ta, and Cu to analyze the variant selections for phase transformation or twinning or both in BCC and FCC systems. In addition, the VirTex analysis is able to characterize the phase transformation and twinning variants in nanocrystalline Fe and Ta microstructures. Besides characterizing variants, orientation mapping also provides an accelerated and on-the-fly approach for quantifying twin fractions in MD microstructures. Graphical abstract: [Figure not available: see fulltext.].

Bibliographic Details

Avanish Mishra; Marco J. Echeverria; Ke Ma; Shayani Parida; Ching Chen; Sergey Galitskiy; Avinash M. Dongare

Springer Science and Business Media LLC

Materials Science; Engineering

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