Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging
Journal of Materials Science: Materials in Electronics, ISSN: 1573-482X, Vol: 27, Issue: 12, Page: 12729-12763
2016
- 49Citations
- 42Captures
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Review Description
Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have been extensively investigated. With the extensive prevalence of 3D IC package, a major concern of Sn–Ag–Cu based solders today is continuously focused on extending service life of solder bonding formed between solders and substrates. The critical issues and improvements on Sn–Ag–Cu solders bearing alloys and nanoparticles are outlined and evaluated in this review. It can be summarized that appropriate content of certain alloys or nanoparticles addition to Sn–Ag–Cu solder is possible to tailor the solder properties, such as the melting and solidification behaviors, oxidation resistance, wettability, (interfacial) microstructure, and mechanical properties. Worthy of note is that reliability issues such as creep behavior, thermomechanical fatigue, electromigration, thermomigration and Sn whisker were briefly discussed and analyzed to lay down a solid foundation for the future development of 3D IC technology.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84979582230&origin=inward; http://dx.doi.org/10.1007/s10854-016-5407-3; http://link.springer.com/10.1007/s10854-016-5407-3; http://link.springer.com/content/pdf/10.1007/s10854-016-5407-3.pdf; http://link.springer.com/article/10.1007/s10854-016-5407-3/fulltext.html; https://dx.doi.org/10.1007/s10854-016-5407-3; https://link.springer.com/article/10.1007/s10854-016-5407-3
Springer Science and Business Media LLC
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