Study on electrochemical properties of CMC-PVA doped NHBr based solid polymer electrolytes system as application for EDLC
Journal of Polymer Research, ISSN: 1572-8935, Vol: 27, Issue: 6
2020
- 41Citations
- 38Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
In the present work, solid polymer electrolytes (SPEs) based CMC-PVA blend doped with various contents of NHBr were successfully prepared via solution-casting technique. The prepared samples were then characterized with respect to its thermal and conduction properties by using differential scanning calorimetry (DSC) and impedance spectroscopy. The highest dc conductivity at room temperature is observed to be 3.21 × 10 S cm for a sample that consists of 20 wt.% NHBr which demonstrated good thermal stability of T The CMC-PVA doped NHBr recorded an increment on the ionic conductivity with the increase in temperature, and thus obeys the Arrhenius behavior. The potential window for the highest conducting sample was found to be plateaued at 1.55 V. The performance of the EDLC fabricated with highest ionic conducting CMC-PVA doped NHBr was also examined through cyclic voltammetry (CV) and it was shown that the specific capacitance increased as the scan rate reduced. Based on the charge-discharge profile, it is apparent that the proposed system has excellent cyclic retention as it is able to keep the performance of the EDLC at ~88% even after 1000 cycles.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85084934154&origin=inward; http://dx.doi.org/10.1007/s10965-020-02078-5; https://link.springer.com/10.1007/s10965-020-02078-5; https://link.springer.com/content/pdf/10.1007/s10965-020-02078-5.pdf; https://link.springer.com/article/10.1007/s10965-020-02078-5/fulltext.html; https://dx.doi.org/10.1007/s10965-020-02078-5; https://link.springer.com/article/10.1007/s10965-020-02078-5
Springer Science and Business Media LLC
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