Thick silver electrodeposition on copper substrate for Cd production
Journal of Radioanalytical and Nuclear Chemistry, ISSN: 0236-5731, Vol: 277, Issue: 3, Page: 645-650
2008
- 12Citations
- 6Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
Silver electrodeposition on copper substrate was investigated for production of Ca. The electrodeposition experiments were carried out by the alkaline plating baths. The optimum conditions of the electrodeposition of silver were: 4.1 g/1 silver, pH 10-12, DC current density of ca. 4.27 mA·cm at 40-50 °C temperature with 100% current efficiency. © 2008 Akadémiai Kiadó, Budapest.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=77949269283&origin=inward; http://dx.doi.org/10.1007/s10967-007-7161-8; http://link.springer.com/10.1007/s10967-007-7161-8; http://link.springer.com/content/pdf/10.1007/s10967-007-7161-8; http://link.springer.com/content/pdf/10.1007/s10967-007-7161-8.pdf; http://link.springer.com/article/10.1007/s10967-007-7161-8/fulltext.html; http://www.springerlink.com/index/10.1007/s10967-007-7161-8; http://www.springerlink.com/index/pdf/10.1007/s10967-007-7161-8; https://dx.doi.org/10.1007/s10967-007-7161-8; https://link.springer.com/article/10.1007/s10967-007-7161-8
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