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Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

Journal of Thermal Analysis and Calorimetry, ISSN: 1588-2926, Vol: 136, Issue: 5, Page: 2171-2182
2019
  • 16
    Citations
  • 0
    Usage
  • 20
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    16
    • Citation Indexes
      16
  • Captures
    20

Article Description

We investigated the thermal performance of micro-hole cellular structure using Al O –H O and CuO–H O nanofluids with 0.67% and 0.4%, respectively, of volumetric concentration numerically and then validated these numerical results with the experimental results at a heating power of 345 W. We found that the thermal conductivities of Al O –H O and CuO–H O nanofluids were enhanced by 2% and 1.19%, respectively, as compared to the base fluid (water). Using Al O –H O nanofluids, we achieved the minimum base temperature of 24.5 °C and 26.6 °C numerically and experimentally, respectively, for the micro-hole cellular structure. Using CuO–H O nanofluids, we achieved the minimum base temperature of 25.5 °C and 27.7 °C numerically and experimentally, respectively. The estimated errors between obtained numerical and experimental results were 8.8% and 8.5% for Al O –H O and CuO–H O, respectively. Experimentally, we achieved the lowest base temperature of 26.6 °C and 27.7 °C using Al O –H O and CuO–H O nanofluids, respectively, which was about 17.6% and 14.5% lower than the reported temperature value of 32.3 °C using water (Tariq et al. in Therm Sci, 2018. http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T).

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