Profile calculation of gold nanostructures by dispersed-nanosphere lithography through oblique etching for LSPR applications
Journal of Nanoparticle Research, ISSN: 1388-0764, Vol: 11, Issue: 5, Page: 1065-1074
2009
- 5Citations
- 7Captures
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Article Description
Nanosphere lithography is an inexpensive method used to fabricate gold nanostructures on a substrate. Using dispersed-nanosphere lithography, in which the nanospheres are dispersed on a substrate, 2D or 3D nanostructures can be fabricated by obliquely depositing a gold film on the nanospheres and etching the gold film afterward. These nanostructures are tunable and acute, and are thus good emitting elements for the localized surface plasmon resonance applications. So far, for the fabrication of nanostructures on a substrate with dispersed nanospheres, only 2D nanostructures have been reported through perpendicular etching. We report in this paper that the 3D nanostructures fabricated by dispersed-nanosphere lithography are rigid non-conformal structures, and perpendicular gold etching can be expanded to oblique etching, which provides more possibilities for fabricating the gold nanostructures in various shapes. The profiles of gold nanostructures after several varying angle depositions, and their final profiles after perpendicular or oblique etching, are calculated in this paper. Our profile simulations are applicable for nanospheres (or microspheres) within the range of tens of nanometers to tens of micrometers, and are consistent with our fabricated nanostructures observed using scanning electron and atomic force microscopy. © 2008 Springer Science+Business Media B.V.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=67650754152&origin=inward; http://dx.doi.org/10.1007/s11051-008-9508-7; http://link.springer.com/10.1007/s11051-008-9508-7; http://link.springer.com/content/pdf/10.1007/s11051-008-9508-7; http://link.springer.com/content/pdf/10.1007/s11051-008-9508-7.pdf; http://link.springer.com/article/10.1007/s11051-008-9508-7/fulltext.html; http://www.springerlink.com/index/10.1007/s11051-008-9508-7; http://www.springerlink.com/index/pdf/10.1007/s11051-008-9508-7; https://dx.doi.org/10.1007/s11051-008-9508-7; https://link.springer.com/article/10.1007/s11051-008-9508-7
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