Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu
Journal of Electronic Materials, ISSN: 0361-5235, Vol: 37, Issue: 10, Page: 1591-1597
2008
- 18Citations
- 7Captures
Metric Options: Counts1 Year3 YearSelecting the 1-year or 3-year option will change the metrics count to percentiles, illustrating how an article or review compares to other articles or reviews within the selected time period in the same journal. Selecting the 1-year option compares the metrics against other articles/reviews that were also published in the same calendar year. Selecting the 3-year option compares the metrics against other articles/reviews that were also published in the same calendar year plus the two years prior.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
The volume effect in the reaction between Zn-doped solders and Cu is reported and explained in this article. Zn-doped solders with two different volumes, bulk solder baths (6 g) and small solder balls (10 mg), were reacted with Cu substrates. It was found that the reaction at the interface depended not only on the Zn concentration but also on the volume of the solder. For the bulk solder reaction the Zn concentration stayed nearly constant, whereas in the small solder joint case the Zn concentration changed substantially with the reaction time. This was because the Zn concentration during reaction was different for different solder volumes when the volume effect became important. For bulk solder baths, when the Zn content was 0.5 wt.%, the reaction product was a Cu Sn -based compound. As the Zn content increased to 2 wt.%, the reaction product switched to a Cu Zn -based compound. When the Zn content was 1.0 wt.%, Cu Sn and CuZn formed simultaneously. When the solder volume became smaller, the Zn concentration was no longer constant, and the phase equilibrium at the interface changed with time. It was shown that the shifting of the equilibrium at the interface caused the massive spalling of CuZn. © 2008 TMS.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=51849128171&origin=inward; http://dx.doi.org/10.1007/s11664-008-0521-5; http://link.springer.com/10.1007/s11664-008-0521-5; http://link.springer.com/content/pdf/10.1007/s11664-008-0521-5; http://link.springer.com/content/pdf/10.1007/s11664-008-0521-5.pdf; http://link.springer.com/article/10.1007/s11664-008-0521-5/fulltext.html; https://dx.doi.org/10.1007/s11664-008-0521-5; https://link.springer.com/article/10.1007/s11664-008-0521-5; http://www.springerlink.com/index/10.1007/s11664-008-0521-5; http://www.springerlink.com/index/pdf/10.1007/s11664-008-0521-5
Springer Science and Business Media LLC
Provide Feedback
Have ideas for a new metric? Would you like to see something else here?Let us know