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A low-temperature bonding process using mixed Cu-Ag nanoparticles

Journal of Electronic Materials, ISSN: 0361-5235, Vol: 39, Issue: 8, Page: 1283-1288
2010
  • 143
    Citations
  • 0
    Usage
  • 67
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    143
    • Citation Indexes
      143
  • Captures
    67

Article Description

A low-temperature bonding process to form joints with high strength and ionic migration resistance using mixed Cu-Ag nanoparticles was studied. Although it was difficult to obtain strong joints using Cu nanoparticles, with the addition of Ag nanoparticles to the Cu nanoparticles the bonding strength of the Cu-to-Cu joints increased. The joints formed by the mixed Cu-Ag nanoparticles at 350°C exhibited a high bonding strength of ∼50 MPa. Counterelectrodes made of the mixed Cu-Ag nanoparticles had four times higher ionic migration resistance compared with counterelectrodes made only of Ag nanoparticles. © 2010 TMS.

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