A low-temperature bonding process using mixed Cu-Ag nanoparticles
Journal of Electronic Materials, ISSN: 0361-5235, Vol: 39, Issue: 8, Page: 1283-1288
2010
- 143Citations
- 67Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
A low-temperature bonding process to form joints with high strength and ionic migration resistance using mixed Cu-Ag nanoparticles was studied. Although it was difficult to obtain strong joints using Cu nanoparticles, with the addition of Ag nanoparticles to the Cu nanoparticles the bonding strength of the Cu-to-Cu joints increased. The joints formed by the mixed Cu-Ag nanoparticles at 350°C exhibited a high bonding strength of ∼50 MPa. Counterelectrodes made of the mixed Cu-Ag nanoparticles had four times higher ionic migration resistance compared with counterelectrodes made only of Ag nanoparticles. © 2010 TMS.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=77954625029&origin=inward; http://dx.doi.org/10.1007/s11664-010-1195-3; http://link.springer.com/10.1007/s11664-010-1195-3; http://link.springer.com/content/pdf/10.1007/s11664-010-1195-3; http://link.springer.com/content/pdf/10.1007/s11664-010-1195-3.pdf; http://link.springer.com/article/10.1007/s11664-010-1195-3/fulltext.html; https://dx.doi.org/10.1007/s11664-010-1195-3; https://link.springer.com/article/10.1007/s11664-010-1195-3; http://www.springerlink.com/index/10.1007/s11664-010-1195-3; http://www.springerlink.com/index/pdf/10.1007/s11664-010-1195-3
Springer Science and Business Media LLC
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