The Properties of BiTe-Cu Joints Obtained by SPS/FAST Method
Journal of Electronic Materials, ISSN: 1543-186X, Vol: 48, Issue: 6, Page: 3859-3865
2019
- 4Citations
- 14Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
One of the most important challenges connected with the production of thermoelectric modules and their parts is the development of an appropriate joining technology. The produced junctions must be characterised not only by high mechanical strength and good adhesion but also by high electrical conductivity, high heat conductivity and, due to working conditions, by a long-term chemical and temperature stability. This paper presents the results of the investigation of a BiTe/copper junction obtained using lead-free solders. We analyse and discuss junction properties and quality. To produce this connection via resistance soldering under pressure, a spark slasma sintering (SPS/FAST) apparatus was used. The properties of the samples (electrical conductivity and Seebeck coefficient) have been characterized and presented. The microstructure investigations and analysis of the element distribution are also presented.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85071497933&origin=inward; http://dx.doi.org/10.1007/s11664-019-07120-x; http://link.springer.com/10.1007/s11664-019-07120-x; http://link.springer.com/content/pdf/10.1007/s11664-019-07120-x.pdf; http://link.springer.com/article/10.1007/s11664-019-07120-x/fulltext.html; https://dx.doi.org/10.1007/s11664-019-07120-x; https://link.springer.com/article/10.1007/s11664-019-07120-x
Springer Science and Business Media LLC
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