Facile and Green Preparation of Three-Dimensionally Nanoporous Copper Films by Low-Current Electrical Field-Induced Assembly of Copper Nanoparticles for Lithium-Ion Battery Applications
Journal of Materials Engineering and Performance, ISSN: 1544-1024, Vol: 27, Issue: 9, Page: 4680-4692
2018
- 4Citations
- 11Captures
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Article Description
Porous copper (Cu) films were facilely and greenly fabricated by low-current electrical field-induced assembly of ~ 3 nm Cu nanoparticles (NPs) in several minutes using generated hydrogen bubbles as dynamic negative templates. The porous films had open three-dimensionally (3D) interconnected nanopores and uniform pore size distribution and exhibited a hierarchical structure composed of supraparticles that were further composed of the Cu NPs. Lattice-to-lattice connectivity in the self-assembly of the NPs in the 3D structures enables fast charge transport. The structure/morphology of the porous Cu materials can be tuned by adjusting the concentration of the additives, applied potential/current densities and assembly time. A growth mechanism of the porous films was reasonably proposed for the field-induced assembly of the Cu NPs. The porous Cu film-supported Si electrode showed high capacity of 1173 mAh g and retention rate of 87% after 10 cycles at 1 C. Our research sheds a light on preparing 3D nanoporous structures especially for suitable electrodes in electrochemical energy storage devices.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85051775595&origin=inward; http://dx.doi.org/10.1007/s11665-018-3583-4; http://link.springer.com/10.1007/s11665-018-3583-4; http://link.springer.com/content/pdf/10.1007/s11665-018-3583-4.pdf; http://link.springer.com/article/10.1007/s11665-018-3583-4/fulltext.html; https://dx.doi.org/10.1007/s11665-018-3583-4; https://link.springer.com/article/10.1007/s11665-018-3583-4
Springer Science and Business Media LLC
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