Physiological and biochemical mechanisms of silicon-induced copper stress tolerance in cotton (Gossypium hirsutum L.)
Acta Physiologiae Plantarum, ISSN: 0137-5881, Vol: 38, Issue: 11
2016
- 64Citations
- 47Captures
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Article Description
Accumulation of excess copper (Cu) in agricultural soils can decrease growth and quality of crops grown on these soils and a little information is available on the role of silicon (Si) in reducing Cu toxicity in plants. A hydroponic study was conducted to investigate the effects of Si (1.0 mM) on growth and physiology of cotton seedlings grown on different Cu (0, 25, and 50 µM) concentrations. Elevated levels of Cu decreased growth, biomass, photosynthetic pigments, and gas exchange characteristics, and increased the electrolyte leakage (EL), hydrogen peroxide (HO), and thiobarbituric acid reactive substances (TBARS) contents in leaf, stem, and roots of cotton seedlings. Cu stress alone decreased the activities of key antioxidant enzymes in cotton seedlings. Exogenous application of Si alleviated the toxic effects of Cu on cotton seedlings by improving growth, photosynthetic pigments, and gas exchange characteristics under Cu stress. The Si application decreased Cu concentrations in leaves, stem, and roots as compared with the control plants. Furthermore, Si decreased oxidative stress as evidenced by decreased EL, HO, and TBARS contents, and increased the antioxidant enzyme activities in cotton seedlings. This study provides evidences of Si-mediated reduction of Cu toxicity in cotton seedlings at physiological and biochemical levels.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84991628419&origin=inward; http://dx.doi.org/10.1007/s11738-016-2279-3; http://link.springer.com/10.1007/s11738-016-2279-3; http://link.springer.com/content/pdf/10.1007/s11738-016-2279-3.pdf; http://link.springer.com/article/10.1007/s11738-016-2279-3/fulltext.html; https://dx.doi.org/10.1007/s11738-016-2279-3; https://link.springer.com/article/10.1007/s11738-016-2279-3
Springer Science and Business Media LLC
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