Modeling of dynamic recrystallization in white layer in dry hard cutting by finite element—cellular automaton method
Journal of Mechanical Science and Technology, ISSN: 1738-494X, Vol: 32, Issue: 9, Page: 4299-4312
2018
- 25Citations
- 13Captures
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Article Description
White layer formed in hard cutting process has great influence on surface quality of the workpiece, simulation of the white layer has great significance. Dynamic recrystallization critical temperature model is derived to calculate the critical temperature of the dynamic recrystallization in the white layer. A finite element model was developed to simulate the hard cutting process based on the Johnson-Cook constitutive equation. The dynamic recrystallization critical temperature was derived based on the true stress-strain curves obtained by the split Hopkinson pressure bar experiments. The cellular automaton model which aims to simulate the white layer grains formed by the dynamic recrystallization process in hard cutting is established. The temperature and strain data extracted from the finite element model are used in the cellular automaton model. The contrast between the simulation and experimental results demonstrates that the cellular automaton model can simulate the dynamic recrystallization process in the white layer accurately. The dynamic recrystallization processes in the white layer under different cutting speed and flank wear are simulated based on the finite element - cellular automaton model. The results show that the dynamic recrystallization grain size of the white layer decreases with the increase in cutting speed and tool wear.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85053265958&origin=inward; http://dx.doi.org/10.1007/s12206-018-0828-y; http://link.springer.com/10.1007/s12206-018-0828-y; http://link.springer.com/content/pdf/10.1007/s12206-018-0828-y.pdf; http://link.springer.com/article/10.1007/s12206-018-0828-y/fulltext.html; https://dx.doi.org/10.1007/s12206-018-0828-y; https://link.springer.com/article/10.1007/s12206-018-0828-y
Springer Nature America, Inc
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