Evaluating Variability and Improving Tolerance in a Novel and Compact Silicon Photonic Michelson Interferometer
Silicon, ISSN: 1876-9918, Vol: 14, Issue: 15, Page: 9945-9958
2022
- 3Citations
- 2Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
We present a novel, tolerant and compact common mirror silicon photonic Michelson Interferometer (T-CMMI). Firstly, we demonstrate a simple theoretical method to calibrate the design variability by evaluating the thickness and width of the waveguide from the transmission response of a general Michelson interferometer (MI). The calibration error for evaluated width (Δ Error ) and thickness (Δ Error ) using this method is within ± 0.47 nm. Secondly, the virtual wafer-based Monte Carlo (VW-MC) approach is used to model the coordinate aware manufacturing variations of the MI layout at the design stage itself. With fixed input parameters of VM-MC at ΔL = 50 μm, the proposed T-CMMI shows the best tolerance with a peak wavelength standard deviation (σ) value of only 0.32 nm, while the σ values for tapered and nominal MI are 0.83 nm and 1.91 nm respectively. For a maximum tolerance for peak wavelength shift set to ± 0.62 nm, only 23 percent of nominal MI structure, 54 percent of tapered MI, and 91 percent of T-CMMI structure is quantitatively evaluated to be fit for design. (3-sigma method). For the same ΔL of 50 μm, footprint of T-CMMI layout design reduces to 35 μm×135μm compared to tapered MI structure of 125 μm×135μmsaving12.150×103μm2 of wafer area.
Bibliographic Details
Springer Science and Business Media LLC
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