Impact of jet intermittency on surface-structured heat sinks for electronics liquid cooling
Applied Thermal Engineering, ISSN: 1359-4311, Vol: 236, Page: 121911
2024
- 2Citations
- 9Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
The boosting heat generation rate of high-performance processors is challenging the conventional cooling techniques. Passive surface structure designs no longer satisfy the heat dissipation requirement. The present work proposes the combined design of active jet intermittency and passive surface modification in heat sinks, and evaluates the heat transfer enhancement through numerical and experimental approaches. The trapezoidal-waveform flow rate at the inlet has constant time-averaged Reynolds number of 763 and the Strouhal number ranges from 0.01 to 0.04. The surface geometry includes cylindrical groove and hemispherical dimple with different arrangements. The underlying physics of thermal performance improvement is explained by complex flow circulation that disrupts the thermal boundary layer growth and dynamic vortex motion that promotes mixing between near-wall fluid and mainstream coolant. Higher pulsation frequency and smaller duty cycle are beneficial for cooling enhancement while the percentage improvement of dimple structure is higher than groove structure, which agrees with the experimental results. Compared to the steady-flow flat heat sink, a maximum enhancement of 45% is obtained by adopting intermittent jet at grooved surface.
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S1359431123019403; http://dx.doi.org/10.1016/j.applthermaleng.2023.121911; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85183366246&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S1359431123019403; https://dx.doi.org/10.1016/j.applthermaleng.2023.121911
Elsevier BV
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