Heat transfer performance of novel 3D flat-plate oscillating heat spreader under gravity-assisted and anti-gravity conditions for high-density power electronics cooling

The development of thermal management technologies towards localized heating areas characterized by high heat flux densities has become paramount for the secure operation of electronic devices. For the heat dissipation of high-power-density electronic chips, this article developed an aluminum-based three-dimensional flat-plate oscillating heat spreader (3D-FPOHS) integrating a heat-targeting channel layout design. The 3D-FPOHS can absorb heat at the central region on one side and dissipate heat at the entire area of the other side with the aid of a novel radial interconnected dual-layer channel structure. R1336MZZ was used as the working fluid at a volumetric filling ratio of 40 %. The average maximum temperature of the simulated chip could be maintained at 75.5 ℃ under the heat input of about 600 W (or 67 W/cm 2 ), 9.7 ℃ lower than that of the empty device. The 3D-FPOHS exhibits nearly gravity-independent heat transfer performance at high heat inputs greater than 300 W, having a system thermal resistance of about 0.09 ℃/W at the heat input of 600 W. The 3D-FPOHS shows approximately same start-up performance under gravity-assisted and anti-gravity conditions. This study confirms the potential of 3D-FPOHS acting as an integrated cooler for electronic devices, providing a promising option for temperature control of high-power density heat dissipation both under gravity-assisted and anti-gravity conditions.