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Polyrotaxane based leakage-proof and injectable phase change materials with high melting enthalpy and adjustable transition temperature

Chemical Engineering Journal, ISSN: 1385-8947, Vol: 444, Page: 136421
2022
  • 17
    Citations
  • 0
    Usage
  • 13
    Captures
  • 1
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    17
  • Captures
    13
  • Mentions
    1
    • News Mentions
      1
      • 1

Most Recent News

Studies Conducted at IMDEA Materials Institute on Phase Change Materials Recently Reported (Polyrotaxane Based Leakage-proof and Injectable Phase Change Materials With High Melting Enthalpy and Adjustable Transition Temperature)

2023 JAN 19 (NewsRx) -- By a News Reporter-Staff News Editor at Nanotech Daily -- New research on Nanotechnology - Phase Change Materials is the

Article Description

In this work, a series of advanced phase change materials (PCMs) were fabricated by using polyrotaxane (PLR) as supports for encapsulating poly (ethylene glycol) (PEG). Phase-change enthalpy is mainly regulated by the PEG contents, whereas phase change temperature is controlled by PEG molecular weight. All PCMs have good form stabilities due to the good compatibility between PLR and PEG, and supporting ability of PLR. Given that the PLR support itself has phase-transition properties, the resulting composites have high phase change enthalpies (116.1–162.2 J g -1 ) and very high enthalpy efficiency (>100%). It is a green and efficient preparation method because the whole preparation process did not involve organic solvents, and the material was prepared at room temperature. In addition, the obtained PCMs can be easily extruded and re-molded, which provides technical premise and convenience for the large-scale applications. As a typical application example, the PCMs showed its significant advantages in simulated solid-state disk model temperature regulation, which fully demonstrates the practical and superior application value of the PCMs in the field of thermal management for electronic devices.

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