Parametric design and performance evaluation of TPMS porous vitrified bond diamond grinding wheel using digital light processing
Ceramics International, ISSN: 0272-8842, Vol: 50, Issue: 21, Page: 41831-41847
2024
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Investigators from Henan University of Technology Have Reported New Data on Ceramics Research (Parametric Design and Performance Evaluation of Tpms Porous Vitrified Bond Diamond Grinding Wheel Using Digital Light Processing)
2024 NOV 04 (NewsRx) -- By a News Reporter-Staff News Editor at Tech Daily News -- Current study results on Technology - Ceramics Research have
Article Description
Porous vitrified bond diamond grinding wheels are commonly used for grinding hard and brittle materials. However, uneven pore distribution and low porosity affect the grinding performance of the wheel significantly. In this study, three types of triply periodic minimal surface porous vitrified bond diamond grinding wheels—Gyroid, Diamond, and Lidinoid–were prepared through parametric designing and digital light processing 3D printing. The grinding wheel achieved a uniform distribution and an interconnected pore structure. The key to high-performance grinding wheel via stereolithography 3D printing lies in the preparation of the slurry with high solid loading, low viscosity and uniform stability. Hence, the effect of surface modifiers on the slurry, along with the effect of sintering temperature and the microscopic and mechanical properties, was investigated. By grinding the SiC ceramics, the material removal rate, grinding temperature, and surface roughness were compared to those achieved using a conventional solid-structure grinding wheel. The results show that the slurry with the highest solid content of 80 wt% (58 vol%) and viscosity of 4.21 Pa s (30 s −1 ) can be prepared using surface-modified particles. The diamond grinding wheel sintered at 680 °C exhibits the best comprehensive performance. A grinding wheel prepared using stereolithography 3D printing can achieve better surface roughness and lower the grinding temperature.
Bibliographic Details
Elsevier BV
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