Interconnected network of Ag and Cu in bioplastics for ultrahigh electromagnetic interference shielding efficiency with high thermal conductivity
Composites Communications, ISSN: 2452-2139, Vol: 30, Page: 101093
2022
- 27Citations
- 9Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
Herein, we synthesize the silver (Ag)-copper (Cu) double layer via electroless plating of Cu using a thin Ag layer as a catalyst on the biodegradable polylactic acid (PLA). Then, we perform hot compression molding for fabricating PLA/Ag/Cu nanocomposites. We found out that the uniform thin Ag layer not only acts well as a catalyst for Cu deposition, but disperses Cu successfully to form a 3D Cu conductive network. And, Ag also enhances the oxidation resistance of Cu. Thanks to the homogeneous interconnected Cu structure along Ag, the fabricated PLA/Ag/Cu nanocomposites exhibit an exceptional electromagnetic shielding efficiency (EMI SE) of 101.8 dB at 0.5 mm thickness and excellent in-plane (11.22 W/mK), through-plane (3.44 W/mK) thermal conductivity with only Ag (2.4 vol%) and Cu (6.3 vol%).
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S2452213922000377; http://dx.doi.org/10.1016/j.coco.2022.101093; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85124764942&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S2452213922000377; https://dx.doi.org/10.1016/j.coco.2022.101093
Elsevier BV
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