Molecular dynamics simulation of liquid film boiling on solid metal and liquid metal surfaces

The argon liquid films boiling with different thicknesses on heated solid metal copper and heated liquid metal gallium surfaces was studied by molecular dynamics simulation. The effects of liquid film thickness and surface flexibility on boiling phenomenon were analyzed. The results show that a thinner liquid film can be used to obtain a sufficient vaporization energy and enable rapid vaporization at the initial stage of heating, and vapor cavity growth will rapidly tear the liquid film, which promotes boiling heat transfer and avoids the occurrence of film boiling. Compared with the boiling phenomenon on the surface of solid metal, the generation and departure of vapor cavities on the surface of liquid metal increases the fluctuation of the contact surface, which is conducive to heat transfer between the substrate and liquid film, resulting in more intense boiling. This study is helpful to understand the microscopic mechanism of boiling heat transfer on the surface of liquid metal, and provides a reference for its application in industrial fields.