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Study on the evolution of interfacial (Cu,Ni) 6 Sn 5 and shear property of (111)Cu/Sn/Ni micro joints under isothermal and TG-bonding

Intermetallics, ISSN: 0966-9795, Vol: 147, Page: 107614
2022
  • 10
    Citations
  • 0
    Usage
  • 1
    Captures
  • 0
    Mentions
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Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    10
    • Citation Indexes
      10
  • Captures
    1

Article Description

Single-crystal Cu can be potentially applied as pad or micro bump in bonding technology for advanced packaging. A novel bonding method with an extra temperature gradient (TG, TG-bonding) was carried out to bonding single-crystal (111)Cu and poly-crystal Ni substrates with Sn as interlayer. The morphology and orientation evolution, elemental distribution and growth kinetics of interfacial (Cu,Ni) 6 Sn 5 intermetallic compound (IMC) in (111)Cu/Sn/Ni micro joints during isothermal and TG-bonding were investigated. Regular roof-type (Cu,Ni) 6 Sn 5 grains along three intersectant directions with an angle of 60° formed at the initial Sn/(111)Cu interface and maintained the roof-type morphology with (112‾0) preferred orientation throughout the isothermal bonding. For TG-bonding, TG-induced atomic thermomigration (TM) and Cu–Ni cross-interaction co-played a critical role in the morphology, grain feature and growth kinetics of the interfacial IMCs. Moreover, rapid growth of (Cu,Ni) 6 Sn 5 phase was achieved by TG-bonding with (111)Cu as hot end to fabricate full IMC joints which had higher shear strength than the cases of isothermal and TG-bonding with (111)Cu as cold end. The proposed method would provide a further insight for developing bonding technology for advanced packaging.

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