Fabrication and heat dissipation performance of diamond/Cu composite with diamond bars inserted in the normal direction
Journal of Alloys and Compounds, ISSN: 0925-8388, Vol: 992, Page: 174579
2024
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
In this paper, a new type of diamond/Cu composite with diamond bars inserted in the normal direction is designed and prepared by vacuum brazing. In order to reduce the negative effect of the low thermal conductivity of Cu-Sn-Ti solder, diamond particles were added into the solder area. The microstructure, thermal conductivity, and heat dissipation performance of the diamond/Cu composite under water-free and water-cooling conditions were studied and compared. Besides, the heat dissipation mechanism of the composite was explored through finite element analysis. The results show that the diamond bars and diamond particles can be connected well by the CuSnTi solder, and the diamond particles scatter in the solder area. The TC tests show that the sample with 2000 mesh diamond particles has the highest TC (515.25 W/(m·K)). Besides, both the heating experiments on the electronic heating platform and the actual heat dissipation performance under water-cooling conditions affirm the excellent heat dissipation effect of the composite with 2000 mesh diamond particles. In conclusion, the diamond/Cu composite with diamond bars inserted vertically possess an excellent structural design, which is promising in heat dissipation material for electronic devices.
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S0925838824011666; http://dx.doi.org/10.1016/j.jallcom.2024.174579; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85190981390&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S0925838824011666; https://dx.doi.org/10.1016/j.jallcom.2024.174579
Elsevier BV
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