On the modelling and experimental study of CO 2 laser ablation on resin-bond diamond grinding wheels: Understanding the effect of processing parameters on the time-dependent temperature field
Journal of Manufacturing Processes, ISSN: 1526-6125, Vol: 124, Page: 1471-1484
2024
- 1Citations
- 4Captures
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Article Description
The need for the precise dressing of diamond abrasive tools by laser has been highly emphasised but determining controllable material removal strategies for precise laser processing remains challenging due to the complex interaction between the composite abrasive materials and the laser beam. To fill this gap, an innovative simulation model pertaining to the laser ablation process has been devised to study the temporal evolution of the temperature field distribution within the ablation zone during processing, alongside monitoring the alterations in ablation depth along the feed direction. The laser spot focus size and the cross-section laser energy intensity distribution along the beam propagation direction, as well as the dynamic, unsteady-state heat conduction and convection, are considered in this model. Based on the simulation results, the ablation law regarding temperature field distribution and ablation depth variation with laser power and feed rate is revealed. It is shown that the laser power has a limited impact on the shape of temperature field distribution, but the core temperature of the heat-affected zone increases with laser power. The feed rate affects mainly the distribution range of the heat-affected zone and the range shrinks with the feed rate. It is revealed that a higher laser power with a matched higher feed rate is highly expected to optimise the ablation. Finally, the simulation results are experimentally validated and reasonable agreements are obtained. The work provides numerical and experimental evidence to evaluate the time-dependent temperature distribution during the laser ablation process.
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S1526612524006601; http://dx.doi.org/10.1016/j.jmapro.2024.07.007; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85198320740&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S1526612524006601; https://dx.doi.org/10.1016/j.jmapro.2024.07.007
Elsevier BV
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