Interface toughening in multilayered systems through compliant dissipative interlayers
Journal of the Mechanics and Physics of Solids, ISSN: 0022-5096, Vol: 130, Page: 1-20
2019
- 10Citations
- 18Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
The effect on an interlayer on the toughness of an interface between a ductile thin film and an elastic substrate is investigated by finite element modeling and assessed towards experimental measurements. The model is based on an asymptotic K -field formulation relying on cohesive zone elements to simulate the fracture process. A compliant interlayer tends to increase the interface toughness by promoting plastic dissipation in the thin layer. Additional toughening can result from the development of plastic strains in the interlayer. The magnitude of these two toughening mechanisms depends on the film thickness, among other parameters. The model predictions are confirmed by comparison with wedge-opening test data performed on a multilayer composed of a thin Cu layer and a polymer interlayer embedded between two stainless steel substrates. These findings lay the foundation for the design of tougher multilayers and provide a critical assessment of experimental protocols for interface toughness measurements requiring the bonding of a dummy substrate, such as used for DCB or four point bending tests.
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S0022509619301589; http://dx.doi.org/10.1016/j.jmps.2019.05.013; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85066101263&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S0022509619301589; https://dx.doi.org/10.1016/j.jmps.2019.05.013
Elsevier BV
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