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Interface toughening in multilayered systems through compliant dissipative interlayers

Journal of the Mechanics and Physics of Solids, ISSN: 0022-5096, Vol: 130, Page: 1-20
2019
  • 10
    Citations
  • 0
    Usage
  • 18
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    10
    • Citation Indexes
      10
  • Captures
    18

Article Description

The effect on an interlayer on the toughness of an interface between a ductile thin film and an elastic substrate is investigated by finite element modeling and assessed towards experimental measurements. The model is based on an asymptotic K -field formulation relying on cohesive zone elements to simulate the fracture process. A compliant interlayer tends to increase the interface toughness by promoting plastic dissipation in the thin layer. Additional toughening can result from the development of plastic strains in the interlayer. The magnitude of these two toughening mechanisms depends on the film thickness, among other parameters. The model predictions are confirmed by comparison with wedge-opening test data performed on a multilayer composed of a thin Cu layer and a polymer interlayer embedded between two stainless steel substrates. These findings lay the foundation for the design of tougher multilayers and provide a critical assessment of experimental protocols for interface toughness measurements requiring the bonding of a dummy substrate, such as used for DCB or four point bending tests.

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