Preparation, applications and challenges of nanofluids in electronic cooling: A systematic review
Materials Today: Proceedings, ISSN: 2214-7853, Vol: 43, Page: 366-372
2021
- 75Citations
- 122Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
An electronic devices cooling are one of the primary challenge of newer generation technology. Nanofluids have expanded enthusiasm for many engineering fields because of its excellent characteristics, which can be effectively utilized in electronics cooling and also improve energy effectiveness. The researchers throughout a world examine a viability of the nanofluids utilization in various equipment and phenomenon. Determination of suitable heat transfer fluid for dissipation of heat is a significant for thermal management of electronic devices. Previously, several examinations have been done to discover the impact of various nanofluids flow in different electronic cooling application for thermal performance. The purpose of this review summarizes the significant outcomes with respect to the improvement in the nanofluids for theoretical and experimental results. Also, some fascinating angles about utilizing nanofluids in electronic components cooling are introduced. Practically all studies have exhibited the preferred nanofluids thermal behavior in electronic cooling, compared to the base fluids. Moreover, the direction for future developments and the difficulties into the field are presented and discussed.
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S2214785320393548; http://dx.doi.org/10.1016/j.matpr.2020.11.679; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85104289583&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S2214785320393548; https://api.elsevier.com/content/article/PII:S2214785320393548?httpAccept=text/xml; https://api.elsevier.com/content/article/PII:S2214785320393548?httpAccept=text/plain; https://dul.usage.elsevier.com/doi/; https://dx.doi.org/10.1016/j.matpr.2020.11.679
Elsevier BV
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