Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs
Microelectronics Reliability, ISSN: 0026-2714, Vol: 87, Page: 89-96
2018
- 12Citations
- 7Captures
- 1Mentions
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Article Description
A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated.
Bibliographic Details
http://www.sciencedirect.com/science/article/pii/S0026271418303202; http://dx.doi.org/10.1016/j.microrel.2018.05.014; http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=85048275156&origin=inward; https://linkinghub.elsevier.com/retrieve/pii/S0026271418303202; https://dul.usage.elsevier.com/doi/; https://api.elsevier.com/content/article/PII:S0026271418303202?httpAccept=text/xml; https://api.elsevier.com/content/article/PII:S0026271418303202?httpAccept=text/plain; https://dx.doi.org/10.1016/j.microrel.2018.05.014
Elsevier BV
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