Molecular dynamics study on the temperature effect on shear failure of epoxy adhesive

This study aims to investigate the shear behavior of epoxy resin adhesives at different temperatures, and to reveal the shear mechanism through experimental tests and molecular dynamics(MD) simulations. The shear strength at different temperatures was experimentally tested. With the increase of temperature, the shear strength decreases obviously. Then, the three-layer shear model was constructed based on the experimental process, and shear simulations were conducted at the corresponding temperatures. The simulations reveal that with increasing temperature, the adhesive exhibit more intense thermal motion, leading to a decrease in cohesive energy density. Additionally, as the temperature rises, the energy of the system increases, rendering it more unstable and resulting in a decrease in shear strength. This study provides valuable insights into the temperature effects on the shear process of epoxy resin adhesives.