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Devising a method to measure film adhesion through modeling

Applied Physics Letters, ISSN: 0003-6951, Vol: 81, Issue: 9, Page: 1615-1617
2002
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A method for measuring film adhesion is devised. It consists of a series of patterned film strips with different widths on a substrate, such that the driving force for each strip to debond increases as strip width increases when the system is subjected to residual and/or applied stresses. In this case, only those strips with sufficient driving force debond while the others remain attached to the substrate. Hence, qualitative comparison of the interface debond energy can be obtained by comparing the strip width below which debonding no longer occurs. By calculating the driving force for each strip to debond, the interface debond energy can be quantitatively determined. © 2002 American Institute of Physics.

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