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Mechanical analysis of interconnected structures using process simulation

Journal of Applied Physics, ISSN: 0021-8979, Vol: 93, Issue: 10 1, Page: 6039-6049
2003
  • 10
    Citations
  • 0
    Usage
  • 6
    Captures
  • 0
    Mentions
  • 0
    Social Media
Metric Options:   Counts1 Year3 Year

Metrics Details

  • Citations
    10
    • Citation Indexes
      10
  • Captures
    6

Article Description

The mechanical behavior of polycrystalline materials used in silicon based technology was analyzed using a technology computer aided design program. A computational process with quick convergence was proposed to analyze microstructures combining both nonlinear viscoelastic and elastoplastic materials. The modeling takes into account not only the thermal stress but also the etching related stress and the intrinsic/extrinsic stresses.

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