Mechanical analysis of interconnected structures using process simulation
Journal of Applied Physics, ISSN: 0021-8979, Vol: 93, Issue: 10 1, Page: 6039-6049
2003
- 10Citations
- 6Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
The mechanical behavior of polycrystalline materials used in silicon based technology was analyzed using a technology computer aided design program. A computational process with quick convergence was proposed to analyze microstructures combining both nonlinear viscoelastic and elastoplastic materials. The modeling takes into account not only the thermal stress but also the etching related stress and the intrinsic/extrinsic stresses.
Bibliographic Details
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