Novel temperature dependent tensile test of freestanding copper thin film structures
Review of Scientific Instruments, ISSN: 0034-6748, Vol: 83, Issue: 6, Page: 064702
2012
- 25Citations
- 55Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Metrics Details
- Citations25
- Citation Indexes25
- CrossRef25
- 24
- Captures55
- Readers55
- 55
Review Description
The temperature dependent mechanical properties of the metallization of electronic power devices are studied in tensile tests on micron-sized freestanding copper beams at temperatures up to 400 °C. The experiments are performed in situ in a scanning electron microscope. This allows studying the micromechanical processes during the deformation and failure of the sample at different temperatures. © 2012 American Institute of Physics.
Bibliographic Details
AIP Publishing
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