Microstructural change in electroformed copper liners of shaped charges upon plastic deformation at ultra-high strain rate

Transmission electron microscopy (TEM) observations were carried out for examining the as-formed and postdeformed microstructures in a variety of electroformed copper liners of shaped charges. The deformation was carried out at an ultra-high strain rate. Specifically, the electron backscattering Kikuchi pattern (EBSP) technique was utilized to examine the micro-texture of these materials. TEM observations revealed that these electroformed copper liners of shaped charges have a grain size of about 1-3 μn. EBSP analysis demonstrated that the as-grown copper liners of shaped charges exhibit a 110 fiber micro-texture which is parallel to the normal direction of the surface of the liners of shaped charges. Having undergone plastic deformation at ultra-high strain rate (10 s), the specimens which were recovered from the copper slugs were found to have grain size of the same order as that before deformation. EBSP analysis revealed that the 1 1 0 fiber texture existed in the as-formed copper liners disappears in the course of deformation. TEM examination results indicate that dynamic recovery and recrystallization play a significant role in this deformation process.