Copper coin-embedded printed circuit board for heat dissipation: Manufacture, thermal simulation and reliability
Circuit World, ISSN: 0305-6120, Vol: 41, Issue: 2, Page: 55-60
2015
- 5Citations
- 15Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
Citation Benchmarking is provided by Scopus and SciVal and is different from the metrics context provided by PlumX Metrics.
Article Description
Purpose - The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach - Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings - The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value - The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84928387861&origin=inward; http://dx.doi.org/10.1108/cw-11-2014-0052; http://www.emeraldinsight.com/doi/10.1108/CW-11-2014-0052; http://www.emeraldinsight.com/doi/full-xml/10.1108/CW-11-2014-0052; http://www.emeraldinsight.com/doi/full/10.1108/CW-11-2014-0052; https://www.emerald.com/insight/content/doi/10.1108/CW-11-2014-0052/full/html; https://www.emerald.com/insight/content/doi/10.1108/CW-11-2014-0052/full/xml
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