Extraction of a SPICE via model from full-wave modeling for differential signaling
2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), Vol: 2, Page: 577-582
2004
- 111Usage
- 9Captures
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Example: if you select the 1-year option for an article published in 2019 and a metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019. If you select the 3-year option for the same article published in 2019 and the metric category shows 90%, that means that the article or review is performing better than 90% of the other articles/reviews published in that journal in 2019, 2018 and 2017.
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Metrics Details
- Usage111
- Downloads102
- Abstract Views9
- Captures9
- Readers9
Conference Paper Description
This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
Bibliographic Details
http://ieeexplore.ieee.org/document/1349862/; http://xplorestaging.ieee.org/ielx5/9324/29634/01349862.pdf?arnumber=1349862; http://dx.doi.org/10.1109/isemc.2004.1349862; https://scholarsmine.mst.edu/ele_comeng_facwork/1619; https://scholarsmine.mst.edu/cgi/viewcontent.cgi?article=2618&context=ele_comeng_facwork
Institute of Electrical and Electronics Engineers (IEEE)
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