Measurement techniques for thermal conductivity and interfacial thermal conductance of bulk and thin film materials
Journal of Electronic Packaging, ISSN: 1528-9044, Vol: 138, Issue: 4
2016
- 376Citations
- 1,008Captures
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Article Description
Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source (TPS) method are most used. For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error. Selecting a specific measurement technique to characterize thermal properties needs to be based on: (1) knowledge on the sample whose thermophysical properties are to be determined, including the sample geometry and size, and the material preparation method; (2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; and (3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.
Bibliographic Details
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84992382898&origin=inward; http://dx.doi.org/10.1115/1.4034605; https://asmedigitalcollection.asme.org/electronicpackaging/article/doi/10.1115/1.4034605/384410/Measurement-Techniques-for-Thermal-Conductivity; http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4034605/6045875/ep_138_04_040802.pdf; https://dx.doi.org/10.1115/1.4034605; https://asmedigitalcollection.asme.org/electronicpackaging/article-abstract/138/4/040802/384410/Measurement-Techniques-for-Thermal-Conductivity?redirectedFrom=fulltext
ASME International
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